Next-2Digits
01/10/2023 – 31/12/2026
Grant agreement ID: 101120651
Prof. Ioanna Zergioti
National Technical University of Athens (NTUA), Greece
National Technical University of Athens (NTUA), Greece
Graphenea Semiconductor S.L. (GSEMI), Spain
Ommatidia Lidar S.L. (OMMA), Spain
Silex Microsystems AB (SILEX), Sweden
Seneseair AB (SENSE), Sweden
YellowScan (YSCAN), France
Linköpings Universiteit (LIU), Sweden
Bert energy GmbH (BERT), Germany
Teknologian Tutkimuskeskus VTT OY (VTT), Finnland
AMIRES SRO (AMI), Czech Republic
Gooch & Housego (Torquay) Limited (G&H), United Kingdom
The next generation of sensors and imagers enabled by 2D materials digital integration
Graphene and other 2D materials in the PIC and OEIC industry have offered a novel paradigm in integrated Photodetectors and Modulators with miniature footprints and ultrawide bandwidth, outperforming the standard materials and architectures.
Next-2Digits innovation introduces the direct wafer-scale integration of graphene in PICs using two additive technologies:
- semi-dry transfer of Graphene layers for full wafer scale integration and direct die processing, and
- Laser Digital Transfer of intact 2D materials pixels directly on the stack, with no need for post-processing.
In this way, relevant interfaces will be largely defect-free with high carrier mobilities and large bandwidths, with significant advantages in terms of cost, material, and energy saving, and reduced resulting waste.
Next-2Digits’ Graphene-based PDs and MDs will be integrated into three device demonstrators, validated at TRL5:
- A miniaturized LiDAR with an integrated graphene photodetector installed in an Unmanned Aerial Vehicle.
- A PIC greenhouse gas sensor with a high sensitivity and a miniaturized footprint offering multi-sensing capability, tested in two types of biogas plants.
- An on-chip Polarization Diversity Receiver offering extended bandwidth and high resolution for biomedical Optical Coherence Tomography imaging in a cardiovascular application.