The next generation of sensors and imagers enabled by 2D materials digital integration

Graphene and other 2D materials in the PIC and OEIC industry have offered a novel paradigm in integrated Photodetectors and Modulators with miniature footprints and ultrawide bandwidth, outperforming the standard materials and architectures.

Next-2Digits innovation introduces the direct wafer-scale integration of graphene in PICs using two additive technologies:

  • semi-dry transfer of Graphene layers for full wafer scale integration and direct die processing, and
  • Laser Digital Transfer of intact 2D materials pixels directly on the stack, with no need for post-processing.

 

In this way, relevant interfaces will be largely defect-free with high carrier mobilities and large bandwidths, with significant advantages in terms of cost, material, and energy saving, and reduced resulting waste.

Next-2Digits’ Graphene-based PDs and MDs will be integrated into three device demonstrators, validated at TRL5:

  1. A miniaturized LiDAR with an integrated graphene photodetector installed in an Unmanned Aerial Vehicle.
  2. A PIC greenhouse gas sensor with a high sensitivity and a miniaturized footprint offering multi-sensing capability, tested in two types of biogas plants.
  3. An on-chip Polarization Diversity Receiver offering extended bandwidth and high resolution for biomedical Optical Coherence Tomography imaging in a cardiovascular application.